View F9223L-F219_7669964.PDF datasheet online --- IC-ON-LINE

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??????s?@? not recommend for new design.
??????s?@? not recommend for new design.
d w g . n o . ms5f06456 t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . h04-004-03a 3/24 2.block diagram 3.pin disignation and function g d s q 1 ? d 1 , s 2 s 1 o u t i s n s v c c p v c c v r e f c o m p c s c b c o n s t b v w g n d p g n d g n d v c c v r e f c o m p ? c s ? c b ? c o n ? s t b ? v w ? i c 2 3 d 2 g d s ? g 2 q 2 1.application this specifies m-power:F9223L-F219 applied to multi-oscillated current resonant type power supply. pin no. symbol function 4 s1 mosfet(q1) source (5) mosfet(q1) source current detection 7 vcc power supply 8 gnd ground (9) mosfet(q1) source current detection ground 10 vref reference voltage output 11 comp input feedback signal for constant voltage control 12 cs soft-start and soft-end oscillation 13 cb burst oscillation 14 con reference oscillation of q1 on-term 15 stb standby operarion signal input alarm output for latched-shutdown 16 vw q1 turn-on and off timing detection 19 d1,s2 q1 drain and q2 source (1)(2)(18) 20 g2 q2 gate 23 d2 q2 drain (22) note: * pins 3,17,and21 is cut. * pins 1,2,5,9,18,and22 no pin frames. * pin 6 is disconnected. this pin is connectd to the q1 gate but never connect it for waveform observation or any other purpose. connection of the pin 6 could lead to major problems and could destroy the m-power. ??????s?@? not recommend for new design.
d w g . n o . ms5f06456 t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . h04-004-03a 4/24 4.control ic block diagram ??????s?@? not recommend for new design.
d w g . n o . ms5f06456 t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . h04-004-03a 5/24 trade mark type name lot. no 5.out view ??????s?@? not recommend for new design.
d w g . n o . ms5f06456 t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . h04-004-03a 6/24 6.absolute maximum ratings : vcc=19v , tc=tj(ic)=tch(q1,q2)=25 ? c section item symbol ratings units remarks min max mos-fet drain-source voltage v ds -1.5 +500 v q1 and q2 continuous drain current i d -5.3 +5.3 a q1: i dpulse -21.2 +21.2 a 19-4 terminal gate-source voltage v gs -30 +30 v q2: maximum power dissipation p d - 35 w 23-19 terminal control ic voltage v cc1 -0.3 +28 v 7-8terminal v cc2 v zener current i z 0 +10 ma max.power dissipation p dic - 1.0 w output current at vref i ref - 20 ma 10-8 terminal voltage at con v con -0.3 v ref v 14-8 terminal voltage at cb v cb -0.3 v ref v 13-8 terminal voltage at cs v cs -0.3 v ref v 12-8 terminal voltage at comp v comp -0.3 v ref v 11-8 terminal voltage at stb v stb -0.3 v ref v 15-8 terminal voltage at vw v w -1.3 v cc v 16-8 terminal voltage at s1 v s -1.0 v ref v 4-8 terminal operating frequency f 15 150 khz 16-8 terminal temperature operating temperature tc -20 +125 junction temperature tch -20 +150 tj -20 +150 storage temperature tstg -40 +150 note : * the operating frequency in the absolute maximum rating is the operating frequency at normal operation.about the absolute maximum rating of operating frequency at standby operation, refer to the "allowable frequency at standby operation curve" in 12/24 page. * vcc and vref in maximum ratings mean that it is necessary to make the applied voltage lower than the voltage of vcc and a vref terminal. for example , if the voltage will be applied to the terminal at no vref voltage , it will be expected to latched shutdown. self limiting ??????s?@? not recommend for new design.
d w g . n o . ms5f06456 t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . h04-004-03a 7/24 7.electrical characteristics : vcc=19v , tc=tj(ic)=tch(q1,q2)=25 ? c note: capacitor of 2000pf or more should be connected between con and gnd terminals. section item symbol test condition rating units remarks min typ max mos-fet drain-source breakdown voltage b vdss i d = 2 5 0 a , v g s =0v 500 \ - v q1: gate threshold voltage v gs(th) i d = 2 5 0 a , v ds =v gs 3.5 4.0 4.5 v 19-4 terminal zero gate voltage drain current i dss v ds =500v,v g s =0v - - 25 a q2: drain-source on-state resistance rds(on) i d =2.5a,v g s =10v - 0.40 0.50 23-19 terminal input capacitance ciss v ds =25v - 1200 - pf output capacitance coss v g s =0v - 170 - pf reverse transfer capacitance crss f=1mhz - 9 - pf td(on) vd=400v - 17.0 - ns turn-on time tr v g s =10v - 10.0 - ns td(off) i d =2.5a - 55.0 - ns turn-off time tf r gs = 1 0 - 28.0 - ns diode forward on-voltage v sd i f =10a,v gs =0v - 1.0 1.5 v reverse recovery time trr i f =i dr ,v gs =0v - 360 - ns reverse recovery charge qrr -di f / d t = 1 0 0 a / s - 2.1 - c control start threshold voltage v cc(o n) 15.5 16.5 17.5 v 7-8 terminal ic stop threshold voltage v ccl(off) 7.9 8.9 9.9 v power hysteresis v cch =v cc(on) -v ccl(off) 6.8 7.6 8.4 v supply cancellation voltage of burst operation v ccb 9.1 10.0 10.9 v hysteresis v ccbh =v ccb -v ccl(o ff) 0.73 1.30 1.87 v over voltage threshold voltage v cch(off) 24.0 26.0 28.0 v latch-stop cancellation voltage v cc(la) 0.9 2.6 4.1 v operating current i cc f=75khz 7.5 9.0 10.5 ma zener voltage v z i cc =10ma 28.0 30.0 34.0 v reference voltage v ref 4.7 5.0 5.3 v 10-8 terminal con oscillation discharge current i on(dis) 6.5 9.1 11.7 ma 14-8 terminal charge current i on(chg) 420 575 730 a amplitude of con voltage v onlh 2.7 3.2 3.7 v maximum voltage v on(max) 3.5 3.9 4.3 v cb oscillation discharge current i b(dis) 8.4 11.2 14.0 ma 13-8 terminal charge current i b(chg) 40 52 64 a amplitude of cb voltage v blh 0.70 0.85 1.00 v cs oscillation discharge current i s(dis) 79 105 131 a 12-8 terminal charge current i s(chg) 83 109 139 a start threshold voltage of q1 switching v b2h 0.63 0.71 0.79 v stop threshold voltage of q1 switching v b2l 0.54 0.63 0.72 v feedback (comp) stop voltage v comp 0.61 0.71 0.81 v 11-8 terminal source current i comp 0.65 0.95 1.25 ma standby(stb) standby threshold voltage v stbon 0.85 1.10 1.35 v 15-8 terminal voltage v stboff 2.75 3.10 3.45 v internal resistance at latched-shutdown r stb 100 220 340 timing detection(vw ) q1 turn-on threshold voltage v w h 0.65 0.78 0.91 v 16-8 terminal voltage v w l 0.45 0.58 0.71 v over current over current operating voltage v oc 0.83 0.90 0.97 v 4-8 terminal protection operating time to latched- shutdown td la 0.07 0.10 0.13 s reset time td lar 70 100 130 s short-circuit current limiting voltage v sc 1.2 1.5 1.8 v overheating protection operating temperature tj oh 125 - 150 switching rise time tr - - 0.15 s only q1 characteristics fall time tf - 0.35 s 19-8 terminal thermal channel to case rth (ch-c) only q1 or q2 heating - - 3.5 /w q1 and q2 resistance channel to ambient rth (ch-a) q1 and q2 heating - - 84 /w ??????s?@? not recommend for new design.
d w g . n o . ms5f06456 t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . h04-004-03a 8/24 safe operating area tc=25 d=0.01 0.01 0.1 1 10 100 1 10 100 1000 vds[v] i d [ a ] t = 1 s 1 0 1 0 0 1m s [mos-fet] allowable power dissipation 0 10 20 30 40 50 0 25 50 75 100 125 150 tch[ ] p d [ w ] transfer characteristics 0.01 0.1 1 10 100 0 1 2 3 4 5 6 7 8 9 10 vgs[v] i d [ a ] vds=25v transconductance 0.1 1 10 100 0.1 1 10 100 id[a] g f s [ s ] vds=25v t t t t d= 8.characteristics diagram : vcc=19v,tc=tj(ic)=tch(q1,q2)=25 ? c,f=75khz output characteristics 0 5 10 15 20 25 30 35 0 5 10 15 20 25 30 vds[v] i d [ a ] v gs=20v 10v 7v 6.5v 6v 5.5v 5v drain-source on-state resistance 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0 5 10 15 20 25 30 35 id[a] r d s ( o n ) [ ] 20v 10v 7v 6.5v 6v 5.5v vgs =5v ??????s?@? not recommend for new design.
d w g . n o . ms5f06456 t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . h04-004-03a 9/24 transient thermal impedance 0.001 0.01 0.1 1 10 1e-06 1e-05 1e-04 0.001 0.01 0.1 1 10 t[sec] z t h ( c h - c ) [ k / w ] d=0 gate threshold voltage vs tch 2 2.5 3 3.5 4 4.5 5 5.5 6 -25 0 25 50 75 100 125 150 tch[ ] v g s ( t h ) [ v ] i d = 2 5 0 a vds=vgs max. min. capacitance 1 10 100 1000 10000 0.1 1 10 100 1000 vds[v] c [ p f ] vgs=0v f=1mhz ciss coss crss forward characteristics of reverse diode 0.01 0.1 1 10 100 0 0.5 1 1.5 vsd[v] i f [ a ] vgs=0v gate charge characteristics 0 5 10 15 20 25 0 10 20 30 40 50 60 70 qg[nc] v g s [ v ] id=5a vdd=250v drain-source on-state resistance 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 -25 0 25 50 75 100 125 150 tch[ ] r d s ( o n ) [ ] id=2.5a v gs=10v max. typ. ??????s?@? not recommend for new design.
d w g . n o . ms5f06456 t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . h04-004-03a 10/24 [ic] vcc-icc : normal operation 0 2 4 6 8 10 0 5 10 15 20 vcc[v] i c c [ u a ] stop start vcc-icc : standby operation 0 2 4 6 8 10 0 5 10 15 20 vcc[v] i c c [ u a ] start stop vcc-icc : normal operation 0 5 10 15 0 5 10 15 20 25 30 vcc[v] i c c [ m a ] stop start vcc-icc : normal operation latched shutdown 0 5 10 15 0 5 10 15 20 25 30 vcc[v] i c c [ m a ] stop start latched at vcch(off) zener clump vcc-icc : normal operation latched shutdown 0 20 40 60 80 100 0 5 10 15 20 vcc[v] i c c [ a ] start latch operation current vcc-icc : standby operation 0 5 10 15 0 5 10 15 20 25 30 vcc[v] i c c [ m a ] stop start vccb ??????s?@? not recommend for new design.
d w g . n o . ms5f06456 t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . h04-004-03a 11/24 tj=tc=tch-vcc 0 10 20 30 -25 0 25 50 75 100 125 tj=tc=tch[ ] v c c [ v ] vcch(off) vcc(on) vccb vccl(off) vcc(la) f-icc 0 5 10 15 20 0 50 100 150 f[khz] i c c [ m a ] normal operation standby operation burst duty-icc 0 5 10 15 0 20 40 60 80 100 duty[%] i c c [ m a ] tc=tj=tch-icc 0 2 4 6 8 10 12 -25 25 75 125 tc=tj=tch[ ] i c c [ m a ] normal operation at f=75khz standby operationat at f=75khz,burst duty =20% vcc-icc : standby operation latched shutdown 0 5 10 15 0 5 10 15 20 25 30 vcc[v] i c c [ m a ] stop start latched at vcch(off) zener clump vcc-icc : standby operation latched shutdown 0 20 40 60 80 100 0 5 10 15 20 vcc[v] i c c [ a ] start latch operation current ??????s?@? not recommend for new design.
d w g . n o . ms5f06456 t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . h04-004-03a 12/24 allowable power dissipation 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 25 50 75 100 125 150 tj[ ] p d [ w ] allowable frequency at standby operation 0 50 100 150 200 250 300 350 0 20 40 60 80 100 burst duty [%] f [ k h z ] vcc-vref 4.75 4.80 4.85 4.90 4.95 5.00 5.05 5.10 5.15 5.20 5.25 10 15 20 25 vcc[v] v r e f [ v ] tc=tj=tch-vref 4.75 4.80 4.85 4.90 4.95 5.00 5.05 5.10 5.15 5.20 5.25 -25 0 25 50 75 100 125 tc=tj=tch[ ] v r e f [ v ] tc=tj=tch-ton 16 17 18 19 20 21 22 -25 0 25 50 75 100 125 tc=tj=tch[ ] t o n [ s ] at con=3300pf con-ton 0 10 20 30 40 50 2000 3000 4000 5000 6000 7000 con[pf] t o n [ s ] ??????s?@? not recommend for new design.
d w g . n o . ms5f06456 t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . h04-004-03a 13/24 cb-fb 1 10 100 1000 0 1 10 100 c b [ f ] f b [ h z ] tc=tj=tch-fb 350 400 450 -25 0 25 50 75 100 125 tc=tj=tch[ ] f b [ h z ] a t c b = 0 . 1 5 f cs-dv/dt 0.1 1.0 10.0 100.0 0.001 0.010 0.100 1.000 c s [ f ] d v / d t [ v / m s ] tc=tj=tch-dv/dt 0 1 2 3 4 -25 0 25 50 75 100 125 tc=tj=tch[ ] d v / d t [ v / m s ] a t c s = 0 . 0 4 7 f +dv/dt -dv/dt vcomp-icomp 0.0 0.2 0.4 0.6 0.8 1.0 0.0 1.0 2.0 3.0 4.0 5.0 vcomp[v] i c o m p [ m a ] tc=tj=tch-vcomp 0.0 0.2 0.4 0.6 0.8 1.0 -25 0 25 50 75 100 125 tc=tj=tch[ ] v c o m p [ v ] ??????s?@? not recommend for new design.
d w g . n o . ms5f06456 t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . h04-004-03a 14/24 vcs-vcon 0.0 1.0 2.0 3.0 4.0 0.0 1.0 2.0 3.0 4.0 vcs[v] v c o n [ v ] vcomp-vcon 0.0 1.0 2.0 3.0 4.0 0.0 1.0 2.0 3.0 4.0 vcmp[v] v c o n [ v ] tc=tj=tch-vstb 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 -25 0 25 50 75 100 125 tc=tj=tch[ ] v s t b [ v ] vstboff vstbon tc=tj=tch-rstb 0 100 200 300 400 500 -25 0 25 50 75 100 125 tc=tj=tch[ ] r s t b [ ] tc=tj=tch-vw 0.4 0.5 0.6 0.7 0.8 0.9 -25 0 25 50 75 100 125 tc=tj=tch[ ] v w [ v ] vwh vwl tc=tj=tch-voc,vsc 0.0 0.5 1.0 1.5 2.0 -25 0 25 50 75 100 125 tc=tj=tch[ ] v o c < v s c [ v ] vsc voc ??????s?@? not recommend for new design.
d w g . n o . ms5f06456 t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . h04-004-03a 15/24 tc=tj=tch-tdla 0.08 0.09 0.10 0.11 0.12 -25 0 25 50 75 100 125 tc=tj=tch[ ] t d l a [ s ] tc=tj=tch-tr1,tf1(q1) 0.0 0.1 0.2 0.3 0.4 0.5 -25 0 25 50 75 100 125 tc=tj=tch[ ] t r 1 , t f 1 [ s ] tf1 tr1 ??????s?@? not recommend for new design.
d w g . n o . ms5f06456 t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . h04-004-03a 16/24 9. description item test circuit description v dss fig.1 v cc =v gs =0v,i d = 2 5 0 a v gs(th) (q2) fig.2 i d = 2 5 0 a , v gs =v ds i dss fig.3 v cc =v gs =0v,v ds =500v r ds(on) (q1) fig.4 v cc =v gs =19v,i d =2.5a r ds(on) (q2) fig.5 v gs =10v,i d =2.5a v sd fig.6 i f =10a,v cc =v gs =0v v cc(on) fig.7 vcc voltage to output vref after vcc's going up from 0v. v ccl(off) fig.7 vcc voltage to stop outputting vref after vcc's going down from v cc(on) . v cch - =v cc(on) v ccl(off) v ccb fig.8 vcc voltage to cancel standby operation after vcc's going down at standby operation(stb=l). v ccbh - =v ccb v ccl(off) v cch(off) fig.8 vcc voltage to latching shutdown after vcc's going up from v cc(on) . v cc(la) fig.8 vcc voltage to cancel latching shutdown operation. i cc fig.8 vcc=19v,vcc terminal current at 75khz operation. v z fig.7 vcc voltage at icc=10ma. v ref fig.7 reference output voltage. i on(dis) fig.8 sink current at con terminal. i on(chg) fig.8 source current at con terminal. v onlh fig.8 the amplitude voltage at con terminal. v on(max) fig.8 threshold voltage at h level of v onlh . i b(dis) fig.8 sink current at cb terminal. i b(chg) fig.8 source current at cb terminal. v blh fig.8 the amplitude voltage at cb terminal. i s(dis) fig.8 sink current at cs terminal. i s(chg) fig.8 source current at cs terminal. v b2h fig.8 start threshold voltage of q1 switching. v b2l fig.8 stop threshold voltage of q1 switching. v comp fig.8 stop threshold voltage of q1 switching. i comp fig.8 source current at comp terminal. v stbon fig.9 standby threshold voltage after v stb 's going down from v stboff . v stboff fig.9 standby cancellation voltage after v stb 's going up from v stbon . r stb fig.10 internal resistance at latched-shutdown. v w h fig.11 q1 turn-on threshold voltage after vw's going up. v w l fig.11 q1 turn-off threshold voltage after vw's going down. v oc fig.12 s1 terminal voltage of over current with latched shuddown.(0.1 second timer) td la fig.12 in continuously abnormal state, time until latching shutdown. td lar fig.12 in uncontinuously abnormal state, time to cancel latching shutdown timer. v sc fig.12 s1 terminal voltage of short circuit current with latched shutdown.(1 time) tr fig.8 rise time of mos-fet(q1). tf fig.8 fall time of mos-fet(q1). t on - maximum on width of mos-fet(q1). c on - the capacitance which is connected between con and gnd. f b - burst frequency at standby operation. c b - the capacitance which is connected between cb and gnd. dv/dt - dv/dt of cs terminal voltage. c s - the capacitance which is connected between cs and gnd. tc - case temperature.(back side of pakage) tj - junction temperature of control ic. t ch - channel temperature of mos-fet(q1 and q2). f - switching frequency of q1. ??????s?@? not recommend for new design.
d w g . n o . ms5f06456 t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . h04-004-03a 17/24 v c c v r e f ? c o m p ? c s ? c b ? c o n ? s t b ? v w d 2 g 2 ? d 1 , s 2 ? s 1 g n d v 2 3 1 m a d 2 d 1 , s 2 ? v 1 m a 2 3 [ q 1 ] [ q 2 ] v d s s v c c v r e f ? c o m p ? c s ? c b ? c o n ? s t b ? v w d 2 g 2 ? d 1 , s 2 ? s 1 g n d v 2 3 1 m a [ q 2 ] v g s ( t h ) v c c v r e f ? c o m p ? c s ? c b ? c o n ? s t b ? v w d 2 g 2 ? d 1 , s 2 ? s 1 g n d d 2 d 1 , s 2 ? a 2 3 2 3 [ q 1 ] [ q 2 ] i d s s a v c c v r e f ? c o m p ? c s ? c b ? c o n ? s t b ? v w d 2 g 2 ? d 1 , s 2 ? s 1 g n d v 2 3 i d [ q 1 ] r d s ( o n ) : q 1 v c c v r e f ? c o m p ? c s ? c b ? c o n ? s t b ? v w d 2 g 2 ? d 1 , s 2 ? s 1 g n d 2 3 d 2 d 1 , s 2 ? v i f 2 3 [ q 1 ] [ q 2 ] v s d v i f v c c v r e f ? c o m p ? c s ? c b ? c o n ? s t b ? v w d g ? d 1 , s ? s g n d v 2 3 r d s ( o n ) : q 2 i d fig.1 vdss fig.2 vgs(th) fig.3 idss fig.4 rds(on):q1 fig.5 rds(on):q2 fig.6 vsd ??????s?@? not recommend for new design.
d w g . n o . ms5f06456 t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . h04-004-03a 18/24 v c c v r e f ? c o m p ? c s ? c b ? c o n ? s t b ? v w d 2 g 2 ? d 1 , s 2 ? s 1 g n d 2 3 v c c ( o n ) , v r e f v c c v r e f ? c o m p ? c s ? c b ? c o n ? s t b ? v w d g ? d 1 , s ? s g n d 2 3 v c c b , v d s a v c c v r e f ? c o m p ? c s ? c b ? c o n ? s t b ? v w d g ? d 1 , s ? s g n d 2 3 v s t b v d s a v c c v r e f ? c o m p ? c s ? c b ? c o n ? s t b ? v w d g ? d 1 , s ? s g n d 2 3 r s t b v 2 . 7 m a v c c v r e f ? c o m p ? c s ? c b ? c o n ? s t b ? v w d g ? d 1 , s ? s g n d 2 3 v w v d s a v c c v r e f ? c o m p ? c s ? c b ? c o n ? s t b ? v w d g ? d 1 , s ? s g n d 2 3 v o c , v d s v fig.7 vcc(on),etc... fig.8 vccb,etc... fig.9 vstb fig.10 rstb fig.11 vw fig.12 voc,etc... v ref ??????s?@? not recommend for new design.
d w g . n o . ms5f06456 t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . h04-004-03a 19/24 10. reliability test items all guaranteed values are under the categories of reliability per non-assembled. test test testing methods and conditions reference sampling acceptance no. items standard number number eiaj ed4701 1 terminal pull force : 10n a-111a strength f o r c e m a i n t a i n i n g d u r a t i o n : 1 0 1 s e c method 1 5 (tensile) 2 terminal load force : 5n a-111a strength number of times :2times(90deg./time) method 3 5 (bending) 3 mounting pressure-bonding force : 80n a-112 (0:1) strength method 3 5 4 vibration frequency : 100hz to 2khz acceleration : 200m/s 2 a-121a 15 sweeping time : 4min./1 cycle 4cycles for each x,y&z directions. 5 shock peak amplitude: 15km/s 2 a-122a duration time : 0.5ms test code d 15 3times for each x,y&z directions. 6 solderability solder temp. : 245 ? 5 ? c immersion time : 5 ? 0.5sec a-131a each terminal shall be immersed in test code a 15 the solder bath within 1 to 1.5mm from the body. 7 resistance to solder temp. : 260 ? 5 ? c soldering heat immersion time : 10 ? 1sec a-132 15 number of times : 1time 1 high temp. t e m p e r a t u r e : 1 5 0 + 5 / - 5 c b-111a 22 storage test duration : 1000hr 2 low temp. t e m p e r a t u r e : - 4 0 + 5 / - 5 c b-112a 22 storage test duration : 1000hr 3 temperature t e m p e r a t u r e : 8 5 2 c b-121a humidity r e l a t i v e h u m i d i t y : 8 5 5 % test code c 22 storage test duration : 1000hr 4 temperature t e m p e r a t u r e : 8 5 2 c humidity r e l a t i v e h u m i d i t y : 8 5 5 % b-122a 22 bias bias voltage : v ds (max) * 0.8,v cc =24v, test code c v comp =0v test duration : 1000hr 5 unsaturated t e m p e r a t u r e : 1 3 0 2 c (0:1) pressurized r e l a t i v e h u m i d i t y : 8 5 5 % b-123a 22 vapor vapor pressure : 230kpa test code c test duration : 96hr 6 temperature high temp.side : 150 ? 5 ? c cycle low temp.side : -40 ? 5 ? c b-131a 22 duration time : ht 30min,lt 30min test code a number of cycles : 100cycles 7 thermal shock fluid : pure water(running water) high temp.side : 100+0/-5 ? c b-141a 22 low temp.side : 0+5/-0 ? c test code a duration time : ht 5min,lt 5min number of cycles : 10cycles m e c h a n i c a l t e s t m e t h o d s c l i m a t i c t e s t m e t h o d s ??????s?@? not recommend for new design.
d w g . n o . ms5f06456 t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . h04-004-03a 20/24 test test testing methods and conditions reference sampling acceptance no. items standard number number eiaj ed4701 1 intermittent ta=25 ? 5 ? c operating ? tc=90degree d-322 22 life tch ? tch(max.) (0:1) test duration : 3000 cycle 2 htrb t e m p e r a t u r e : 1 5 0 + 0 / - 1 5 c (drain-source) bias voltage : v ds =v ds (max)*0.8, d-323 22 v cc =v cc (max),v comp =0v test duration : 1000hr e n d u r a n c e t e s t m e t h o d s failure criteria failure criteria item symbol lower limit upper limit unit drain-source breakdown voltage bv dss l 0 . 8 - v zero gate voltage drain current i dss - u 2 a drain-source on-state resistance r ds(on) - u 1 . 2 diode forward on-voltage v sd - u 1 . 2 v start threshold voltage v cc(on) l 0 . 9 u 1 . 1 v stop threshold voltage v ccl(off) l 0 . 9 u 1 . 1 v hysteresis v cch l 0 . 9 u 1 . 1 v cancellation voltage of burst operation v ccb l 0 . 9 u 1 . 1 v hysteresis v ccbh l 0 . 9 u 1 . 1 v over voltage threshold voltage v cch(off) l 0 . 9 u 1 . 1 v operating current i cc l 0 . 8 u 1 . 2 ma reference voltage v ref l 0 . 9 u 1 . 1 v charge current i on(chg) l 0 . 8 u 1 . 2 ma charge current i b(chg) l 0 . 8 u 1 . 2 ma charge current i s(chg) l 0 . 8 u 1 . 2 ma over current operating voltage v oc l 0 . 9 u 1 . 1 v stop voltage vcomp l 0 . 9 u 1 . 1 v standby threshold voltage v stbon l 0 . 9 u 1 . 1 v q1 turn-on threshold voltage v wh l 0 . 9 u 1 . 1 v * lsl : lower specification limit * usl : upper specification limit * before any of electrical characteristics measure, all testing related to the humidity h a v e c o n d u c t e d a f t e r d r y i n g t h e p a c k a g e s u r f a c e f o r m o r e t h a n a n h o u r a t 1 5 0 c . e l e c t r i c a l c h a r a c t e r i s t i c s e l e c t r i c a l c h a r a c t e r i s t i c s ??????s?@? not recommend for new design.
d w g . n o . ms5f06456 t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . h04-004-03a 21/24 1 1 . cautions ? although fuji electric is continually improving product quality and reliability, a small percentage of semiconductor products may become faulty. when using fuji electric semiconductor products in your equipment, you are requested to take ad equate safety measures to prevent the equipment from causing physical injury, fire, or other problem in case any of the products fail. it is recommended to make your design fail - safe, flame retardant, and free of malfunction. ? the products described in t his specification are intended for use in the following electronic and electrical equipment which has normal reliability requirements. ? computers ? oa equipment ? communications equipment(terminal devices) ? machine tools ? av equipment ? measurement e quipment ? personal equipment ? industrial robots ? electrical home appliances etc. ? the products described in this specification are not designed or manufactured to be used in equipment or systems used under life - threatening situations. if you are cons idering using these products in the equipment listed below, first check the system construction and required reliability, and take adequate safety measures such as a backup system to prevent the equipment from malfunctioning. ? backbone network equipment ? transportation equipment (automobiles, trains, ships, etc.) ? traffic - signal control equipment ? gas alarms, leakage gas auto breakers ? submarine repeater equipment ? burglar alarms, fire alarms, emergency equipment ? medical equipment ? nuclear co ntrol equipment etc. ? do not use the products in this specification for equipment requiring strict reliability such as(but not limited to): ? aerospace equipment ? aeronautical equipment 1 2 . warnings ? the mosfets should be used in products within t heir absolute maximum rating(voltage, current, temperature, etc.). ? the mosfets may be destroyed if used beyond the rating. ? we only guarantee the non - repetitive and repetitive avalanche capability and not for the continuous avalanche capability which ca n be assumed as abnormal condition .please note the device may be destructed from the avalanche over the specified maximum rating. ? the equipment containing mosfets should have adequate fuses or circuit breakers to prevent the equipment from causing secon dary destruction (ex. fire, e xplosion etc ). ? use the mosfets within their reliability and lifetime under certain environments or conditions. the mosfets may fail before the target lifetime of your products if used under certain reliability conditions. ? be careful when handling mosfets for esd damage. (it is an important consideration. ) ? w h e n h a n d l i n g m o s f e t s , h o l d t h e m b y t h e c a s e ( p a c k a g e ) a n d d o n t t o u c h t h e l e a d s a n d t e r m i n a l s . ? it is recommended that any handling of mosfets is done on grounded ele ctrically conductive floor and tablemats. ??????s?@? not recommend for new design.
d w g . n o . ms5f06456 t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . h04-004-03a 22/24 ? before touching a mosfet terminal , d ischarge any static electricity from your body and clothes by grounding out through a high impedance resistor (about 1m ? ) ? when soldering, in order to protect the mosfets f rom static electricity, ground the soldering iron or soldering bath through a low impedance resistor. ? you must design the mosfets to be operated within the specified maximum ratings(voltage, current, temperature, etc.) to prevent possible failure or des truction of devices. ? consider the possible temperature rise not only for the channel and case, but also for the outer leads. ? do not directly touch the leads or package of the mosfets while power is supplied or during operation in order to avoid electri c shock and burns. ? the mosfets are made of incombustible material. however, if a mosfet fails, it may emit smoke or flame. also, operating the mosfets near any flammable place or material may cause the mosfets to emit smoke or flame in case the mosfets b ecome even hotter during operation. design the arrangement to prevent the spread of fire. ? the mosfets should not used in an environment in the presence of acid, organic matter, or corrosive gas(hydrogen sulfide, sulfurous acid gas etc.) ? the mosfets sho uld not used in an irradiated environment since they are not radiation - proof. ? during open short test, the internal of the mosfets might explode instantaneously and the resin mold package might be blown off when high voltage is applied to the low voltage terminals. make sure in your design that during open short test, high voltage will not be applied to t he low voltage terminals. to avoid accidents and explosion damage if high voltage is applied, use fuses in your design. installation ? soldering involv es temperatures which exceed the device storage temperature rating. to avoid device damage and to ensure reliability, observe the following guidelines from the quality assurance standard. solder ing methods solder temperature and duration ? the immersion depth of the lead should basically be up to the lead stopper and the distance should be a maximum of 1.5mm from the device. ? when flow - soldering, be careful to avoid immersing the package in the solder bath. ? refer to the following the pressure - bonding force reference w hen mounting the device on a heat sink. excess pressure - bonding force causes damage to the device and weak pressure - bonding force will increase t he thermal resistance, both of which conditions may destroy the device. table 1: recommended pressure - bonding force package style recommended pressure - bonding force note sip23 30 C 80 n package type met hods soldering temp. & time note a solder dipping soldering iron 260 5 , 10 1sec through hole package b solder dipping soldering iron 350 10 , 3.5 0.5sec ??????s?@? not recommend for new design.
d w g . n o . ms5f06456 t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . h04-004-03a 23/24 ? t h e h e a t s i n k s h o u l d h a v e a f l a t n e s s w i t h i n 3 0 m a n d r o u g h n e s s w i t h i n 1 0 m . a l s o , k e e p t h e t i g h t e n i n g torque within the limits of this specification. ? improper handling may cause isolation breakdown leading to a critical accident. ex.) over plane off the edges of screw hole. ( r ecommended plane off the edge is c<1.0mm) ? we recommend the use of thermal compound to optimize the efficiency of heat radiation. it is important to evenly apply the compound and to eliminate any air voids. ? we do not recommend to re - use the device once after solder is removed and detac hed from the board. the detached device may not withstand the thermal when solder is removed, or damage by mechanical force. storage ? the mosfets must be stored at a standard temperature of 5 to 35 and relative humidity of 45 to 75%. ? if the storag e area is very dry, a humidifier may be required. in such a case, use only deionized water or boiled water, since the chlorine in tap water may corrode the leads. ? the mosfets should not be subjected to rapid changes in temperature to avoid condensation o n the surface of the mosfets. therefore store the mosfets in a place where the temperature is steady. ? the mosfets should not be stored on top of each other, since this may cause excessive external force on the case. ? the mosfets should be stored with th e lead terminals remaining unprocessed. rust may cause presoldered connections to fail during later processing. ? the mosfets should be stored in antistatic containers or shipping bags. ? under the above storage condition, use the mosfets within one year. 1 3 . compliance with pertaining to restricted substances 1 3 - 1) compliance with the rohs regulations and exemptions this product will be fully compliant with the rohs directive. five out of six substances below which are regulated by the rohs directive in europe are not included in this product. the exception is only lead. the rohs directive has some exemptions. the following relates to this product : lead in high melting temperature type solders (sn - pb solder alloy which contains more than 85%) this pro duct is used to the high melting temperature type solders (sn - pb solders) for die - bonding. moreover, the terminal s used lead - free solder. * the six substances regulated by the rohs directive are: lead, mercury, hexavalent chromium, cadmium, pbb (polyb rominated biphenyls), pbde (polybrominated diphenyl ethers). 1 3 - 2) compliance with the calss - 1 ods and class - 2 ods. (ods: ozone - depleting substances ) this products does not contain and used t h e l a w c o n c e r n i n g t h e p r o t e c t i o n o f t h e o z o n e l a y e r throug h t h e c o n t r o l o f s p e c i f i e d s u b s t a n c e s a n d o t h e r m e a s u r e s ( j a p a n ) , a n d the montreal protocol. ??????s?@? not recommend for new design.
d w g . n o . ms5f06456 t h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . t h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h i r d p a r t y n o r u s e d f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x p r e s s w r i t t e n c o n s e n t o f f u j i e l e c t r i c d e v i c e t e c h n o l o g y c o . , l t d . h04-004-03a 24/24 ? if you have any questions about any part of this specification, please contact fuji electric or its sales agent before using the product. ? neither fuji no r its agents shall be held liable for any injury caused by using the products not in accordance with the instructions. ? the application examples described in this specification are merely typical uses of fuji electric products. ? this specification does n ot confer any industrial property rights or other rights, nor constitute a license for such rights. ??????s?@? not recommend for new design.

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